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CEVA Technologies, Inc. is a leading provider of digital signal processing (DSP) intellectual property (IP) for wireless communications, multimedia, and connectivity applications. The company was founded in 1999 and is headquartered in Mountain View, California, with additional offices in China, India, Israel, South Korea, Taiwan, and the United Kingdom. CEVA's DSP IP cores are used in a wide range of products, including smartphones, tablets, wireless modems, digital cameras, and automotive infotainment systems. The company's IP portfolio includes solutions for 5G wireless communications, Wi-Fi, Bluetooth, and other wireless connectivity standards, as well as audio and voice processing, computer vision, and artificial intelligence. CEVA's customers include some of the world's leading semiconductor companies, such as Broadcom, Intel, Qualcomm, and Samsung, as well as smaller companies and startups. The company's business model is based on licensing its IP to these customers, who then integrate it into their own products. One of CEVA's key strengths is its ability to provide highly optimized DSP IP cores that are tailored to specific applications and standards. This allows its customers to achieve high levels of performance and power efficiency in their products, while also reducing development time and costs. In addition to its core IP business, CEVA also offers a range of software development tools and support services to help its customers integrate its IP into their products. The company has a strong focus on innovation and invests heavily in research and development to stay at the forefront of the industry. Overall, CEVA Technologies, Inc. is a highly respected and successful company in the semiconductor industry, with a strong track record of delivering high-quality DSP IP solutions to its customers. Its focus on innovation, customer service, and collaboration has helped it to maintain a leading position in the market and to continue to grow and expand its business.

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image of BNO085 CEVA Technologies, Inc. - Tape & Reel (TR) Cut Tape (CT)
IMU ACCEL/GYRO/MAG I2C 32BIT
image of FSM300 CEVA Technologies, Inc. - Bulk
IMU MODULE CALIBRATED Z-AXIS
image of FSM305 CEVA Technologies, Inc. - Bulk
IMU MODULE 3D CALIBRATED SPI
image of FSM-9 CEVA Technologies, Inc. - Bulk
IMU MODULE 3D CALIBRATED USB/SPI
image of BNO086 CEVA Technologies, Inc. - Tape & Reel (TR) Cut Tape (CT)
ACCELROMETER/GYRO SMD
image of FSM-9 OEM CEVA Technologies, Inc. - Bulk
IMU MODULE 3D CALIBRATED USB/SPI
image of BNO080 CEVA Technologies, Inc. - Tape & Reel (TR) Cut Tape (CT)
IMU ACCEL/GYRO/MAG I2C 32BIT
image of FSP200 Reference Module CEVA Technologies, Inc. - Bulk
FSP200 REFERENCE MODULE
image of BNO080 DEV KIT CEVA Technologies, Inc. - Bulk
DEVELOPMENT KIT FOR BNO080
image of FSP200 USB/Serial Adaptor CEVA Technologies, Inc. - Bulk
FSP200 USB/SERIAL ADAPTOR
image of FSP200 Development Kit CEVA Technologies, Inc. - Bulk
FSP200 DEVELOPMENT KIT
IMU ACCEL/GYRO/MAG I2C 32BIT
:CEVA Technologies, Inc.
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IMU MODULE CALIBRATED Z-AXIS
:CEVA Technologies, Inc.
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IMU MODULE 3D CALIBRATED SPI
:CEVA Technologies, Inc.
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IMU MODULE 3D CALIBRATED USB/SPI
:CEVA Technologies, Inc.
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ACCELROMETER/GYRO SMD
:CEVA Technologies, Inc.
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IMU MODULE 3D CALIBRATED USB/SPI
:CEVA Technologies, Inc.
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IMU ACCEL/GYRO/MAG I2C 32BIT
:CEVA Technologies, Inc.
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FSP200 REFERENCE MODULE
:CEVA Technologies, Inc.
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DEVELOPMENT KIT FOR BNO080
:CEVA Technologies, Inc.
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FSP200 USB/SERIAL ADAPTOR
:CEVA Technologies, Inc.
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FSP200 DEVELOPMENT KIT
:CEVA Technologies, Inc.
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